Objects to be tested:Substrates, substrate-like materials, high-density interconnect (HDI)

Features:

1. Utilizes Nanotech's unique 3D lighting technology and core algorithms to identify defects, and employs artificial intelligence (AI) technology to reduce false positives;

2. Belt-type conveyor system with vacuum adsorption ensures simultaneous double-sided inspection, resulting in high efficiency;

3. CCD alignment;

4. Unique board surface cleaning method reduces the impact of debris.