The Wafer Plasma Dicing Inspection Equipment is a precision machine vision recognition system that integrates optics, mechanics, electronics, and automation technologies. Based on the unique characteristics of semiconductor industrial production, this product utilizes a highly integrated optical imaging system, the latest data analysis AI algorithms, and a modular system structure.  Its proprietary software can detect wafer defects (such as incomplete etching, contamination, large scratches, and black spots), identify the number of dies and generate a map, retrieve production data, and supports both online and offline automatic optical inspection.